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VNQ5160K资料 | |
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VNQ5160K PDF Download |
File Size : 116 KB
Manufacturer:ST Description:These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:VNQ5160K 厂 家:ST 封 装:SOP24 批 号:08+ 数 量:250 说 明:全新原装,长期稳定供应 |
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运 费: 所在地: 新旧程度: |
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