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UPB553AC

UPB553AC资料
UPB553AC
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File Size : 116 KB
Manufacturer:NEC
Description:Notes: 1. The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is   RJA = 50C/W/device. The device package thermal resistance is RJ-PIN = 15C/W/device. The thermal resistance device pin-to-   ambient through the PC board should not exceed 35C/W/device for operation up to TA = +100C. 2. Voltage values are with respect to device ground, pin 6. 3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of   the display package. Case temperature of the device immediately prior to the light measurement is equal to 25C.
 
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型 号:UPB553AC
厂 家:NEC
封 装:DIP8
批 号:90/91+
数 量:4573
说 明:原装正品,长期稳定供应
 
 
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