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| ULN2803AFWG资料 | |
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ULN2803AFWG PDF Download |
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File Size : 116 KB
Manufacturer:TOS Description:C. Soldering NOTE: The special sealant joining the lead wires to the case will soften during soldering. Care must be taken to not move the leads or body during the soldering process as the softened joints could shift and become disconnected. The sealant will resume its initial strength after cooling. • Minimize the conduction of excessive heat to the thermal cutoff body when soldering. • Maximum soldering time is shown in table above. • Solder 20 mm minimum from the thermal cutoff body. • During soldering, both the thermal cutoff body and leads should be free of any push, pull or twist force. • After soldering, allow the thermal cutoff to cool for 30 seconds minimum without moving it. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：ULN2803AFWG 厂 家：TOS 封 装：SMD 批 号：08+ 数 量：14200 说 明：全新原装大量长期供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
