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| TS464C资料 | |
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TS464C PDF Download |
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File Size : 116 KB
Manufacturer:STM Description:The ISD4004 series utilizes separate analog and digital ground busses. The analog ground (VSSA) pins should be tied together as close to the pack- age as possible and connected through a low- impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a separate low-impedance path to pow- er supply ground. These ground paths should be large enough to ensure that the impedance be- tween the VSSA pins and the VSSD pin is less than 3 W. The backside of the die is connected to VSS through the substrate resistance. In a chip-on- board design, the die attach area must be con- nected to VSS or left floating. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：TS464C 厂 家：STM 封 装：SOP 批 号：08+ 数 量：1000 说 明：全新原装，长期稳定供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
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