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| TLP624-2资料 | |
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TLP624-2 PDF Download |
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File Size : 116 KB
Manufacturer:TOS Description:The MSK 5115 series are highly thermally conductive devices and the thermal path from the package heat sink to the internal junctions is very short. Since the case is electrically isolated from the internal circuitry, the package can be directly con- nected to a heat sink. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLP624-2 厂 家：TOS 封 装：DIP/SOP 批 号：07+ 数 量：2000 说 明：全新库存，专业TOSHIBA供应商 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
