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| TLP3062资料 | |
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TLP3062 PDF Download |
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File Size : 116 KB
Manufacturer:TOS Description: Thermal Conditions This series of regulators has internal power and thermal limiting circuitry designed to protect the device under overload conditions. For continuous normal load conditions however, maximum junction temperature ratings must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction to ambient. This includes junction to case, case to heat sink interface, and heat sink resistance itself. New thermal resistance specifications have been developed to more accurately reflect device temperature and ensure safe operating temperatures. The data section for these new regulators provides a separate thermal resistance and maximum junction temperature for both the Control Section and the Power Transistor. Previous regulators, with a single junction to case thermal resistance specification, used an average of the two values provided here and therefore could allow excessive junction temperature under certain conditions of ambient temperature and heat sink resistance. To avoid this possibility, calculations should be made for both sections to ensure that both thermal limits are met. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for heat flow. Proper mounting is required to ensure the best possible thermal flow from this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. If the case of the device must be electrically isolated, a thermally conductive spacer can be used, as long as its added contribution to thermal resistance is considered. Note that the case of all devices in this series is electrically connected to the output. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：TLP3062 厂 家：TOS 封 装：DIP/SOP 批 号：07+ 数 量：2000 说 明：全新库存，专业TOSHIBA供应商 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
