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| TLC2543CN资料 | |
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TLC2543CN PDF Download |
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File Size : 116 KB
Manufacturer:TI Description:‡ Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 300 mils, except for the N package, which has a trace length of zero. For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology Data Book, literature number SCBD002B. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TLC2543CN 厂 家：TI 封 装：DIP-20 批 号：09+ 数 量：1 说 明：全新原装大量长期供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
