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| TDA4856资料 | |
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TDA4856 PDF Download |
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File Size : 116 KB
Manufacturer:PHILIPS Description:Overall ground is improved if a dense population of plated through holes connect the top and bottom ground layers of the PCB (Printed Circuit Board). This minimizes ground inductance and improves ground continuity. All of the Xinger components are constructed from ceramic filled PTFE composites which possess excellent electrical and mechanical stability having X and Y thermal coefficient of expansion (CTE) of 17 ppm/oC |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TDA4856 厂 家：PHILIPS 封 装：DIP32 批 号：06+ 数 量：1420 说 明：全新原装正品,优势库存热卖中! |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
