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| TDA1082资料 | |
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TDA1082 PDF Download |
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File Size : 116 KB
Manufacturer:PHI Description:Note 2: The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125˚C or 150˚C), the junction-to-ambient thermal resistance (JA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/JA. If this dissipation is exceeded, the die tem- perature will rise above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150˚C, the device will go into thermal shutdown. For the TO-3 package (K, KC), the junction-to-ambient thermal resistance (JA) is 39˚C/W. When using a heatsink, JA is the sum of the 4˚C/W junction-to-case thermal resistance (JC) of the TO-3 package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (T), JA is 54˚C/W and JC is 4˚C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174˚C/W and can be reduced by a heatsink (see Applications Hints on heatsinking). |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号：TDA1082 厂 家：PHI 封 装：DIP16 批 号：06+ 数 量：480 说 明：全新原装正品,优势库存热卖中! |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
