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| TB1021P资料 | |
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TB1021P PDF Download |
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File Size : 116 KB
Manufacturer:TOSHIBA Description: The 833C/W for the SOT-563 package assumes the use of the recommended footprint on a glass epoxy printed cir- cuit board to achieve a power dissipation of 150 milliwatts. There are other alternatives to achieving higher power dis- sipation from the SOT-563 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad®. Using a board material such as Thermal Clad, an aluminum core board, the power dis- sipation can be doubled using the same footprint. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：TB1021P 厂 家：TOSHIBA 封 装：DIP16 批 号：2005 数 量：2000 说 明：原装正品，长期稳定供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
