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| STW9NK90Z资料 | |
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STW9NK90Z PDF Download |
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File Size : 116 KB
Manufacturer:ST Description: NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customers housing. Use caution when handling the devices during all processes. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：STW9NK90Z 厂 家：ST 封 装：TO-247 批 号：09+CHINA 数 量：10250 说 明：原装正品，大量供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
