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MURS340T3G资料 | |
MURS340T3G PDF Download |
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File Size : 116 KB
Manufacturer:ON Description: The power dissipation of the SOTC23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOTC23 package, PD can be calculated as follows: |
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1PCS | 100PCS | 1K | 10K | ||
价 格 | |||||
型 号:MURS340T3G 厂 家:ON 封 装:SMC 批 号:09+ 数 量:12500 说 明:原装正品,大量供应 |
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