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| MURS340T3G资料 | |
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MURS340T3G PDF Download |
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File Size : 116 KB
Manufacturer:ON Description: The power dissipation of the SOTC23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOTC23 package, PD can be calculated as follows: |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MURS340T3G 厂 家：ON 封 装：SMC 批 号：09+ 数 量：12500 说 明：原装正品，大量供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
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