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| MOC8021资料 | |
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MOC8021 PDF Download |
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File Size : 116 KB
Manufacturer:FSC Description:(1) Lead Forming When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Do not use the base of the leadframe as a fulcrum during lead forming. Lead forming should be done before soldering. Do not apply any bending stress to the base of the lead. The stress to the base may damage the BG-LEDs characteristics or it may break the BG-LEDs. When mounting the BG-LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the BG-LEDs. If the BG-LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the BG-LEDs. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MOC8021 厂 家：FSC 封 装：DIP/SOP 批 号：07+ 数 量：2000 说 明：全新库存，专业光电耦合供应商 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
