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| ML4841CP资料 | |
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ML4841CP PDF Download |
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File Size : 116 KB
Manufacturer:ML Description:where TJ(max) is the maximum allowable junction tempera- ture of the die, which is 125C, and TA is the ambient operat- ing temperature. JA is dependent on the surrounding PC board layout and can be empirically obtained. While the JC (junction-to-case) of the SOT23-5 package is specified at 130C /W, the JA of the minimum PWB footprint will be at least 235C /W. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, the resulting JA can range from approximately 180C /W for one square inch to nearly 130C /W for 4 square inches. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing this value. The heat contributed by the dissipation of other devices located nearby must be included in design considerations. |
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| 1PCS | 100PCS | 1K | 10K | ||
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型 号:ML4841CP 厂 家:ML 封 装:DIP16 批 号:06+ 数 量:1260 说 明:全新原装正品,优势库存热卖中! |
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