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| MB02729资料 | |
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MB02729 PDF Download |
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File Size : 116 KB
Manufacturer:MITSUBISHI Description:(1) This data was taken using the JEDEC standard High-K test PCB. (2) Power rating is determined with a junction temperature of 125C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125C for best performance and long term reliability. (3) The THS4271/5 may incorporate a PowerPAD on the underside of the chip. This acts as a heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：MB02729 厂 家：MITSUBISHI 封 装：SSOP20 批 号：2002 数 量：1280 说 明：原装正品，长期稳定供应 |
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