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| L6374DP资料 | |
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L6374DP PDF Download |
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File Size : 116 KB
Manufacturer:ST Description: The 556C/W for the SOTC23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOTC23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad™. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：L6374DP 厂 家：ST 封 装：08+ 批 号：DIP20 数 量：10 说 明：全新原装，长期稳定供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
