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| L3000-5D2资料 | |
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L3000-5D2 PDF Download |
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File Size : 116 KB
Manufacturer:STM Description:The THS4513 incorporates a (QFN) exposed thermal pad on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the QFN thermally enhanced package. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：L3000-5D2 厂 家：STM 封 装：08+ 批 号：SIP 数 量：8500 说 明：全新原装，长期稳定供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
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