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| DS12887A资料 | |
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DS12887A PDF Download |
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File Size : 116 KB
Manufacturer:DALLAS Description:The ThinPakTM Package is a perforated, metalized ceramic substrate attached to the silicon using 302oC solder. An epoxy underfill is applied to protect the high voltage termination from debris. All exterior metal surfaces are tinned with 63pb/37sn solder providing the user with a circuit ready part. It's small size and low profile make it extremely attractive to high dI/dt applications where stray series inductance must be kept to a minimum. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：DS12887A 厂 家：DALLAS 封 装：DIP 批 号：09+ 数 量：3180 说 明：全新原装大量长期供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
