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| BU2092F资料 | |
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BU2092F PDF Download |
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File Size : 116 KB
Manufacturer:ROHM Description:Thermocompression bonding is recommended. Welding or conductive epoxy may also be used. For additional information see Application Note 979, The Handling and Bonding of Beam Lead Devices Made Easy, or Application Note 993, Beam Lead Device Bonding to Soft Substrates. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：BU2092F 厂 家：ROHM 封 装：08+ 批 号：SOP-18 数 量：800 说 明：全新原装，长期稳定供应 |
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运 费： 所在地： 新旧程度： |
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| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
