 |
|||||||
|
|||||||
|
|
|||||||
|
|||||||
|
|
| AQV272资料 | |
|
AQV272 PDF Download |
|
File Size : 116 KB
Manufacturer:PAN Description:For the most current product and ordering information, see the Package Option Addendum located at the end of this data sheet. Thermal pad size: 6.17 mm x 6.17 mm (min), 7,5 mm x 7,5 mm (max). ja = 21C/W (no airflow) or 15C/W (with 200 LPFM airflow), jc = 13.5C/W, and jp (to the bottom PowerPad) = 2C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in x 3 in PCB. |
|
| 相关型号 | |
| ◆ AT24C02C-SSHM | |
| ◆ TPS22959DNYR | |
| ◆ ZR431F01TA | |
| ◆ ZMM55C5V6 | |
| ◆ ZJY-4P | |
| ◆ Z9023106PSC | |
| ◆ Z86L8108SSCR535HTR | |
| ◆ Z86E0812PSC | |
| ◆ Z86319 | |
| ◆ Z8623012SSC | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
|
型 号：AQV272 厂 家：PAN 封 装：DIP/SOP 批 号：07+ 数 量：2000 说 明： |
|||||
|
运 费： 所在地： 新旧程度： |
|||||
| 联系人：林小姐 |
| 电 话：086-755-23815997 |
| 手 机：13632589437 |
| QQ：1097182423,2851921558 |
| MSN： |
| 传 真：0755-23815984 |
| EMail：joylin@hongbotong.com |
| 公司地址： 深圳市福田区深南中路3006号佳和大厦B座2007室 |
