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SN74LVC1G18的产品特征:
*Available in the Texas Instruments
NanoStar™and NanoFree™Packages
*Supports 5-V VCC Operation
*Inputs Accept Voltages to 5.5 V
*Max tpd of 3.4 ns at 3.3 V
*Low Power Consumption, 10-µA Max ICC
*±24-mA Output Drive at 3.3 V
*Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25℃
*Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25℃
*Ioff Supports Partial-Power-Down Mode Operation
*Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
*ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74LVC1G18的技术参数:
Supply voltage range, VCC. . . . . . . . . . . . . . .. . .. . .. . .. .. . -0.5 V to 6.5 V
Input voltage range, VI (see Note 1). . . . . . . . . . . .. . . .. -0.5 V to 6.5 V
Voltage range applied to any output in the high-impedance
or power-off state, VO. . . . . . . .. -0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
(see Notes 1 and 2) . . . .–0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . .. . .. . .. . . . . . . . . . . .. . .. .-50 mA
Output clamp current, IOK (VO < 0). . . . . .. . .. . . . . . . . . . . . . . . -50 mA
Continuous output current, IO . . . . . . .. . . . . . . . . . . . . . . . . . .±50 mA
Continuous current through VCC or GND . . . . . .. . .. . .. . .. . .. . . . .200 mA
Package thermal impedance, θJA(see Note 3):DBV package . . . . 165℃/W
DCK package . . . . . 259℃/W
YEA/YZA package . . 143℃/W
YEP/YZP package . . 123℃/W
Storage temperature range, Tstg. . . .. . . .. . . .. . . . . .. . . ... .-65℃ to 150℃
SN74LVC1G18的产品描述:
This noninverting demultiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G18 is a 1-of-2 noninverting demultiplexer with a 3-state output. This device buffers the data on input A and passes it to either output Y0 or Y1, depending on whether the state of the select (S) input is low or high, respectively.
NanoStar™and NanoFree™package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.